Join us May 8th through the 11th at the 2017 PLM World Event located at the Convention Center and Lucas Oil Stadium in Indianapolis Indiana.

MOORPARK, Calfornia, November 5, 2014 – Celeritive Technologies, Inc. announced today that the US Patent Office has issued US Patent 8,880,212, the second patent covering key innovations of the VoluMill Ultra High-Performance Toolpath technology.

CAVE CREEK, AZ, January. 16, 2013– Celeritive Technologies, Inc., developers of VoluMill™ – announced today that the U.S. Patent and Trademark Office has issued US Patent 8,295,972, covering key innovations of the VoluMill™ Ultra High Performance Toolpath technology.

CAVE CREEK, AZ – Celeritive Technologies, Inc., developers of VoluMill – The Pathway to Competitive Manufacturing through Ultra High-Performance Toolpath Innovations, announced today that it has filed a patent on its new Non-Concentric Milling technology. Designed to reduce tool load and improve chip clearance, this new toolpath generation method is included in VoluMill™ v4.0, the latest release of the popular VoluMill toolpath engine.